PACK EXPO International 2014 Detailed Event Information For PACK EXPO International 2014
PACK EXPO International 2014 -- Food Processing/Packaging Eq., Packaging Eq.
Location/Date: Chicago, IL, United States 11/02/2014 - 11/05/2014
Event Summary:
PACK EXPO International 2014 will focus on the latest developments in packaging and processing technology and will showcase exhibitors' state-of-the-art advances in packaging machinery, processing machinery, converting machinery, materials, packages and containers, and components. Exhibitors will bring their top technicians and engineers to provide packaging solutions to even the toughest packaging challenges. CPP EXPO (Converting & Package Printing) will be co-locating with PACK EXPO International 2014. CPP exhibitors showcase new trends and innovations in the package printing, converting, finishing machinery, and supplies industries. CPP EXPO delivers the latest in printing, coating, slitting and other modern finishing processes to PACK EXPO International attendees.

Contacts:
Ryan Oklewicz, Packaging Machinery Manufacturers Institute

Phone: 703-243-8555
ryan@pmmi.org
Philippa Olsen, Trade Event Programs
Business and Industry Specialist
Phone: 202-482-5449
Philippa.Olsen@trade.gov

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